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 HD74BC245A
Octal Bus Transceivers With 3 State Outputs
REJ03D0282-0400Z (Previous ADE-205-008B (Z)) Rev.4.00 Jul.16.2004
Description
The HD74BC245A provides high drivability and operation equal to or better than high speed bipolar standard logic IC by using Bi-CMOS process. The device features low power dissipation that is about 1/5 of high speed bipolar logic IC, when the frequency is 10 MHz. The device has ten buffers with three state outputs in a 20 pin package. Each device has an active low enable input G and a direction control input DiR. When DiR is high, data flows from the A inputs to the B outputs. When DiR is low, data flows from the B inputs to the A outputs. When G is high, disables both A and B ports by placing then in a high impedance.
Features
* Input/Output are at high impedance state when power supply is off. * Built in input pull up circuit can make input pins be open, when not used. * TTL level input * Wide operating temperature range Ta = -40 to + 85C * Ordering Information
Part Name HD74BC245AP HD74BC245AFPEL HD74BC245ATELL Package Type DILP-20 pin TSSOP-20 pin Package Code DP-20N, -20NEV TTP-20DAV P FP T Package Abbreviation -- EL (2,000 pcs/reel) ELL (2,000 pcs/reel) Taping Abbreviation (Quantity)
SOP-20 pin (JEITA) FP-20DAV
Note: Please consults the sales office for the above package availability.
Function Table
Control Inputs G L L H H: L: Z: High level Low level High impedance L H X DiR B data to A bus A data to B bus Z Operation
Rev.4.00, Jul.16.2004, page 1 of 8
HD74BC245A
Pin Arrangement
DiR A1 A2 A3 A4 A5 A6 A7 A8 GND
1 2 3 4 5 6 7 8 9 10 (Top view)
20 19 18 17 16 15 14 13 12 11
VCC G B1 B2 B3 B4 B5 B6 B7 B8
Absolute Maximum Ratings
Item Supply voltage Input diode current Input voltage Output voltage VCC IIK VIN VOUT Symbol Rating -0.5 to +7.0 30 -0.5 to +7.5 -0.5 to +7.5 V mA V V Unit
Off state output voltage VOUT(off) -0.5 to +5.5 V Storage temperature Tstg -65 to +150 C Note: 1. The absolute maximum ratings are values which must not individually be exceeded, and furthermore, no two of which may be realized at the same time.
Recommended Operating Conditions
Item Supply voltage Input voltage Output voltage Operating temperature VCC VIN VOUT Topr Symbol 4.5 0 0 -40 Min 5.0 -- -- -- Typ 5.5 VCC VCC 85 8 Max V V V C ns/V Unit
Input rise/fall time*1 tr, tf 0 -- Note: 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics.
Rev.4.00, Jul.16.2004, page 2 of 8
HD74BC245A
Logic Diagram
DiR G B1 B2 B3 B4 B5 B6 B7 B8
A1 A2 A3 A4 A5 A6 A7 A8
Rev.4.00, Jul.16.2004, page 3 of 8
HD74BC245A
Electrical Characteristics (Ta = -40C to +85C)
Item Input voltage Output voltage Symbol VIH VIL VOH VOL Input diode voltage Input current VIK II 4.5 4.5 4.5 4.5 4.5 5.5 5.5 5.5 Short circuit output current*1 Off state output current Supply current IOS IOZH IOZL ICCL ICCH ICCZ ICCT*2 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 VCC(V) Min 2.0 -- 2.4 2.0 -- -- -- -- -- -- -- -100 -- -- -- -- -- -- Max -- 0.8 -- -- 0.5 0.55 -1.2 -250 100 1.0 100 -225 -100 -250 31.5 0.5 4.5 1.5 V V V V V V V A A A A mA A A mA mA mA mA IOH = -3 mA IOH = -15 mA IOL = 48 mA IOL = 64 mA IIN = -18 mA VIN = 0 V An or Bn, VIN = 5.5 V DiR or G, VIN = 5.5 V DiR or G, VIN = 7.0 V VO = 0 V, VIN = 5.5 V VO = 2.7 V VO = 0.5 V VIN = 0 or 5.5 V All outputs is "L" VIN = 0 or 5.5 V All outputs is "H" VIN = 0 or 5.5 V All outputs is "Z" VIN = 3.4 or 0.5 V Unit Test Conditions
Notes : 1. Not more than one output should be shorted at a time and duration of the short circuit should not exceed one second. 2. When input by the TTL level, it shows ICC increase at per one input pin.
Switching Test Method (CL = 50 pF)
Ta = 25C VCC = 5.0 V Min Max 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0(Typ) 15.0(Typ) 6.0 6.0 6.0 6.0 9.0 9.0 9.0 9.0 8.0 8.0 8.0 8.0 Ta = -40 to 85C VCC = 5.0 V 10% Min Max 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 -- -- 7.0 7.0 7.0 7.0 11.0 11.0 11.0 11.0 10.0 10.0 10.0 10.0
Item Propagation delay time
Symbol tPLH tPHL tPLH tPHL
Unit ns ns ns ns ns ns pF pF
Test Conditions An to Bn Bn to An G to Bn G to An G to Bn G to An VIN = VCC or GND VI/O = VCC or GND
Output enable time
tZH tZL tZH tZL
Output disable time
tHZ tLZ tHZ tLZ
Input capacitanse Input/output capacitance
CIN CI/O
Rev.4.00, Jul.16.2004, page 4 of 8
HD74BC245A Test Circuit
VCC G
Output
VCC
See Function Table
Input Pulse Generator Zout = 50
A1 B1 DiR
S1 500 CL= 50 pF 450 50 Scope
*4
OPEN 7V
Notes:
1. 2. 3. 4.
CL includes probe and jig capacitance. A2-B2, A3-B3, A4-B4, A5-B5, A6-B6, A7-B7, A8-B8 are identical to above load circuit. S1: Input-Output change switch. Open: tPLH, tPHL, tZH, tHZ 7 V: tZL, tLZ
Rev.4.00, Jul.16.2004, page 5 of 8
HD74BC245A Waveforms-1
tr 90% Input 1.5 V 10% t PLH 90% 1.5 V 10% t PHL 1.5 V 1.5 V VOL 0V VOH Output tf 3V
Waveforms-2
tf 90% 1.5 V 10% t ZL tr 90% 1.5 V 10% t LZ 3.5 V Waveform-A t ZH 1.5 V VOL + 0.3 V t HZ VOH - 0.3 V 1.5 V 0V VOL 3V
G
0V
VOH
Waveform-B
Notes:
1. tr = 2.5 ns, tf = 2.5 ns 2. Input waveform: PRR = 1 MHz, duty cycle 50% 3. Waveform-A shows input conditions such that the output is "L" level when enable by the output control. 4. Waveform-B shows input conditions such that the output is "H" level when enable by the output control.
Rev.4.00, Jul.16.2004, page 6 of 8
HD74BC245A
Package Dimensions
As of January, 2003
Unit: mm
24.50 25.40 Max 20 11
1 0.89
1.27 Max
10 1.30 7.62
7.00 Max 2.54 Min 5.08 Max
0.51 Min
6.30
2.54 0.25
0.48 0.10
0.25 - 0.05 0 - 15
+ 0.11
Package Code JEDEC JEITA Mass (reference value)
DP-20N -- Conforms 1.26 g
Unit: mm
24.50 25.40 Max 20 11
1 0.89
1.27 Max
10 1.30 7.62
7.00 Max 2.54 Min 5.08 Max
0.51 Min
6.30
2.54 0.25
*0.48 0.08
*0.25 0.06 0 - 15
*NI/Pd/AU Plating
Package Code JEDEC JEITA Mass (reference value)
DP-20NEV -- Conforms 1.26 g
Rev.4.00, Jul.16.2004, page 7 of 8
HD74BC245A
As of January, 2003
12.6 13 Max
20
Unit: mm
11
1
10
5.5
0.80 Max
2.20 Max
*0.20 0.05
0.20 7.80 + 0.30 -
1.15
1.27
*0.40 0.06
0.10 0.10
0 - 8
0.70 0.20
0.15
0.12 M
*Ni/Pd/Au plating
Package Code JEDEC JEITA Mass (reference value)
FP-20DAV -- Conforms 0.31 g
As of January, 2003
Unit: mm
6.50 6.80 Max 20 11
4.40
1
10 0.65 1.0 6.40 0.20 0.65 Max
*0.15 0.05
*0.20 0.05
0.13 M
1.10 Max
0.10
0.07 +0.03 -0.04
0 - 8
0.50 0.10
*Ni/Pd/Au plating
Package Code JEDEC JEITA Mass (reference value)
TTP-20DAV -- -- 0.07 g
Rev.4.00, Jul.16.2004, page 8 of 8
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
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